@inproceedings{d55636ef040b4858aa80e8542dbf3edd,
title = "Modeling Magnetron Sputtering Devices with VSIM",
abstract = "Plasma Vapor Deposition (PVD) is used in a variety of industrial applications for coating thin films over a substrate. In the PVD process within magnetron sputtering devices, electrons ionize a background gas and the ensuing ions, accelerated by a potential gradient, strike a target cathode and sputter off neutral atoms. The sputtered material travels ballistically, interacting with the plasma through collisions or depositing on a surface within the chamber.1",
author = "Crossette, \{Nate P.\} and Jenkins, \{Thomas G.\} and Smithe, \{David N.\} and Cary, \{John R.\}",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 45th IEEE International Conference on Plasma Science, ICOPS 2018 ; Conference date: 24-06-2018 Through 28-06-2018",
year = "2018",
month = jun,
day = "24",
doi = "10.1109/ICOPS35962.2018.9576049",
language = "English",
series = "IEEE International Conference on Plasma Science",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "ICOPS 2018 - 45th IEEE International Conference on Plasma Science",
address = "United States",
}